Our booth was visited by numerous trade visitors from the industry - a clear sign of the enormous interest in our solutions. The following highlights took center stage:
Poly-Flo Double Containment Piping System:
A major attraction was our Poly-Flo double containment piping system, celebrated for its compact design and seamless extrusion of inner and outer pipes. This system allows for space-saving installation and enables quick and easy assembly through simultaneous welding. Moreover, it ensures maximum operational safety in critical applications.
Product Catalog Poly-Flo
PURAD High-Purity Piping Systems:
Particularly tailored for semiconductor manufacturing, the PURAD high-purity piping system offers unbeatable advantages in terms of purity, chemical resistance, and durability. Manufactured from premium PVDF-HP, PP-Pure, and ECTFE, PURAD ensures exceptional performance for the safe transport of high-purity media.
Product Catalog PURAD
SP 110-S V3.1 – The Next Generation Welding Technology:
Visitors were captivated by our premium infrared welding machine, the SP 110-S V3.1. Featuring fully automated processes, precise welding results, and digital connectivity via Wi-Fi and Bluetooth, this machine is an indispensable tool for processing high-performance plastics.
SP 110-S V3.1
In addition to these presentations, our team engaged in numerous discussions with visitors, who brought questions, ideas, and project proposals to the table. We deeply appreciate the constructive conversations and overwhelming interest.
We look forward to continuing to develop innovative solutions for the challenges of the semiconductor industry together with you!
Bad Hall, 20.11.2024